2.3. Forkortelser.

Ofte brugte forkortelser:

Diverse

2D: 2 - Dimensionel.

3D: 3 - Dimensionel.

3DP: 3D Printing.

A

ABS: Acrylonitrile Butadiene Styrene.

ADAM: Atomic Diffusion Additive Manufaturing.

ADM: Additive Design and Manufacturing.

AF: Additive Fabrication.

AFP: Automated Fibre Placement.

AIM: Added Interactive Manufacturing.

AKF: Arburg Konstoff Freeform.

ALM: Additive Layer Manufacturing.

AM: Additive Manufacturing.

APF: Arburg Plastic Freeforming.

AR: Augmented Reality (udvidet virkelighed).

B

B2B: Business To Business.

BAAM: Big Area Additive Manufacturing.

BJ: Binder Jetting (processer som blandt andet Prometal og Z Corp).

BMD Bound Metal Deposition

C

CAD: Computer Aided Design.

CAM: Computer Added Manufacturing.

CAO: Computer Added Optimisation.

CDLP: Continous Digital Light Processing.

CE: Conformité Européenne.

CFF: Continous Fiber Filament.

CIM: Ceramic Injection Moulding.

CJP: Colour Jet Printing.

CLC: Closed Loop Control.

CLIP: Continuous Liquid Interface Production.

CMT: Cold Metal Transfer

CMY: Cyan, Magenta and Yellow.

CNC: Computer Numerically Controlled.

CT: Computed Tomography

D

DCP: Direct Croning Proces (samme proces som SGC).

DDL: Direct Diode Laser.

DED: Direct Energy Deposition (processer som blandt andet LENS).

DFAM: Design For Additive Manufacturing.

DLP: Digital Light Processing (omvendt SLA, kaldes det af erhvervsfolk).

DLS: Digital Light Synthesis or Digital Laser Sintering.

DMD: Direct Metal Deposition.

DMLS: Direct Metal Laser Sintering.

DMP: Direct Metal Printing.

DOD: Drop On Demand.

DPC: Direct Printec Circuits.

DPHP: Direct Printec Heating Pattern.

DPM: Digital Part Materialization.

DS: Dansk Standard.

DSPC: Direct Shell Production Casting (lost wax).

DWS: Digital Wax System.

E

EBAM: Electron Beam Additive Manufacturing.

EBM: Electron Beam Melting.

F

FABLAB: Fabrication Laboratory.

FAQ: Frequently Asked Questions (hyppigt stillede spørgsmål).

FDM: Fused Deposition Modeling.

FFF: Fused Filament Fabrication.

FFF: Fri Form Främstilling (svensk betegnelse for RPT).

FIM: Freeform Injection Moulding.

FIM: Film Insert Moulding.

FOT: First Out of Tool (udfaldsemner).

FPC: Flexible Printec Circuits.

FR: Flame Retarding (flammehæmmere).

FST: Flame, smoke and toxicity).

G

GDP: Gel Dispensed Printing

H

HAF: High Absorbing Fluid

HL: Heliolithography

HMT: Hybrid Manufacturing Technology.

I

ILI: Intelligent Liquid Interface.

J

Jet Fusion

L

LAM: Laser Additive Manufacturing.

LBIT: Liquid Based Ink Technology.

LBM: Laser Bean Melting.

LC: Laser Cuising.

LC: Liquid Crystal.

LDS: Laser Direct Structuring.

LENS: Laser Engineered Net Shape.

LGDW: Laser Guided Direct Writing.

LMD: Laser Melting Deposition.

LMD-w: Laser Metal Deposition - wire.

LMF: Laser Metal Fusion.

LMT: Layer Manufacturing.

LOM: Laminated Object Manufacturing.

LPD: Layer Plastic Deposition.

LPF: Laser Pro Fusion.

LRP: Liquid Resin Polymerization.

LS: Laser Sintering.

LSF: Laser Solid Forming.

M

MBJ: Metal Binder Jetting.

MEMS: Micro Electrical Mechanical Systems.

μAFP: Micro Automated Fibre Placement.

MID: Moulded Interconnect Device.

MIM: Metal Injection Moulding.

MJ: Material Jetting (processer som blandt andet Projet og Objet).

MJF: Multi Jet Fusion.

MJM: Multi Jet Modelling.

MJP: Multi Jet Printing.

MJS: Multiphase Jet Solidification.

MLS: Micro Laser Sintering.

MMP: Micro Machining Process.

MPBF: Metal Powder Bed Fusion.

MPM Melt Pool Monitoring.

N

NC: Numerical Controlled.

NPJ: Nano Particle Jetting.

P

PBF: Powder Bed Fusion (processer som blandt andet SLS).

PHP: Printed Heating Pattern.

PLA: Poly Lactic Acid (materiale til 3D Printing).

POM: Precision Optical Manufacturing.

PS: Pilot Serie.

R

RE: Reverse Engineering.

RM: Rapid Manufacturing.

RP: Rapid Prototyping.

RPT: Rapid Prototyping.

RT: Rapid Tooling.

S

SAS: Slide and Seperate technology

SAF: Selective Absorption Fusion

SCS: Solid Creation System (Sony/D-MEC´s SLA maskine).

SDL: Selective Deposition Lamination.

SGC: Solid ground Curing (samme proces som DLP).

SHS: Selective Heat Sintering.

SL: Stereo Lithography.

SLA: Stereo Lithography Apparatus.

SLCOM: Selective Lamination Composite Object Manufacturing.

SLM: selective Laser Melting.

SLS: Selective Laser Sintering.

SLT: Scan LED Technology.

SPJ: Single pass Jetting.

STEP: Selective Thermoplastic Electrophotographic Process

STL: Det er bredt antaget at være en forkortelse af ordet "Stereolithography", men nogle gange omtales det også som "Standard Triangle Language" eller "Standard Tessellation Language". STL - filformatet, er det mest anvendte format til 3D - printning.

SOUP: Solid Object Ultravoilet Plotter (NTT Data CMET´s SLA)

T

Tg - temperatur: temperaturen hvor et plastmateriale går fra at være hårdt, til at være læderagtigt (et materiales såkaldte glasovergangstemperatur).

U

UAM: Ultrasonic Additive Manufacturing (plader svejses sammen og bearbejdes derefter).

UL: Underwriters Laboratories (amerikansk myndighedsgodkendelse).

UV - lys: Ultraviolet lys

V

VDE: Verband Der Elektrotechnik (tysk myndighedsgodkendelse).

VR: Virtuel Reality.

W

WAAM: Wire Arc Additive Manufacturing.